The Shenzhen International Electronic Components and Materials Sourcing Exhibition (ES SHOW) will be held from November 6 to 8, 2024 at the Shenzhen World Exhibition & Convention Center. This year's ES SHOW will be held concurrently with NEPCON ASIA, Automotive World China, AMTS & AHTE South China, and C-TOUCH & DISPLAY SHENZHEN. Together, they form an overlay
a comprehensive exhibition of the whole industry chain from chip to manufacturing.
This event is expected to occupy more than 100,000 square meters of exhibition area, digging deep into the application needs of the electronics industry and providing a platform for professionals in the global electronics industry to exchange and cooperate. Through this exhibition, participants will have the opportunity to explore the latest development trends of the electronics industry, jointly open a new chapter in the electronics industry, and build a bridge to promote industry exchanges and cooperation. In the upcoming exhibition, we will have the opportunity to witness the latest equipment and cutting-edge technology solutions covering the whole industry chain from chip to PCBA process, including semiconductor/IC, active components, passive components, automotive electronics, SIP technology, PCBA, EMS services, semiconductor packaging and testing technology, electronic manufacturing technology, surface mount technology, welding technology, dispensing and spraying technology.
In addition, the joint exhibition of ES SHOW and AWC will comprehensively display automotive front-loading technologies, including key technologies such as MCU, CIS, IGBT, SiC, ADAS, BMS, as well as automobile manufacturing technology, intelligent vehicle technology, new energy vehicle technology, etc. These technologies represent the core semiconductor applications of high-computing power and high-energy-efficiency assisted driving systems and electric/hybrid systems in the future. At the same time, we will also learn about advanced industry technologies and solutions such as touch display, new materials, packaging and testing, and smart factories.